The Fast-Links project: Test Chip #1
Fast Links Test Chip #1
Last year we implemented an experimental transmitter and receiver in
an 0.5µ CMOS process, using the MOSIS service on
Hewlett-Packard's CMOS14 process. This process is an epitaxial N-well
process designed for 3.3 volt operation.
The test chip was fabricated in late 1996.

This plot of the test chip has the receiver at the top and
the transmitter at the bottom. Circuitry for the two functions is
almost completely independent. The die measures 3.8x3mm, a size
dictated mainly by the number of pads required.

The overall chip block diagram is shown above, along with some of the
external connections required for operation. The transmitter/receiver
pairs operate mesochronously. The transmitter section, shown on the
left in this diagram, accepts data from one of three sources: a ROM,
which alternately sends the two 10-bit sequences 0101010100 and
1010101011 used to initialize the receiver's data framer; a RAM, which
can be loaded with 8 words of any desired 10-bit data; and a
linear-feedback shift register which produces a (2^20 - 1)-bit
pseudorandom sequence. The data source for the transmitter, the
contents of the pattern RAM, and the strength coefficients for the
filters are loaded into registers in the transmitter using a serial
scan path.
Equalizing Transmitter
The transmitter section of the chip is essentially that described in
our Hot Interconnects '96 paper, so only an overview is
given here.

The transmitter is realized using 400 MHz circuitry. A 10-phase clock
sequences 10 data bits from 10 current-steering DACs, whose output
strength is determined by the filter, based on the values of 5
successive bits of data.
Tracking Clock Recovery Receiver

A block diagram of the tracking clock recovery receiver is shown above.
Differential inputs are terminated on-chip in an adjustable
terminator. A demultiplexing receiver produces 20 samples of the
incoming bit stream, timed by a 20-phase DLL-based clock generator.
The 20 clock phases are equally spaced on half-bit-cell intervals, and
the overall phase of the clock generator is servoed so that the
samples represent 10 successive bit values, and the neighboring 10
edge values. The data is re-timed into the chip's internal clock
regime in a set of retiming latches, and both the current 10 bits and
the previous 10 bits are output by a set of ``framing'' latches. A
contiguous 10 bits of data is selected from these 20 bits by a funnel
shifter that frames the data to compensate for arbitrary delay across
the interconnect. The funnel shifter is set during initialization by
transmitting a known bit pattern. A matcher examines the incoming
data and, with the help of a small finite state machine, adjusts the
funnel shifter for proper framing.
Analog Voltage Samplers
Several points in the both the transmitter and receiver are
instrumented with circuits to allow us to measure analog voltages
inside the chip. These tiny circuits turned out work so nicely and be
so useful that they are given their own section here.

The analog sampler is essentially a clocked sense amplifier whose
two inputs are the signal to be sampled and a reference voltage
generated off-chip and brought onto the chip through only an ESD
protection network. The reference voltage is low-pass filtered at
each sampler with a long poly resistor and a MOS capacitor. The NMOS
cap shown in the figure is replaced by a PMOS cap for sampled signals
that are referenced to Vdd. The sampler is triggered by an off-chip
sampling clock, generated at PECL levels and distributed differentially
on-chip. Each sampler has a differential buffer amplifier that
converts the PECL input clock levels to full-swing CMOS signals. The
sampler is quite compact, occupying only about 90x180 lambda. Layout
was done very carefully to balance capacitance on the two arms of the
sense amp. Even with perfect transistor matching, it appears that
offsets due to unbalanced charge injection amount to a few 10s of
millivolts. We estimate the aperture of the sampler to be a few 10s
of picoseconds, but plan to measure it on another test chip now in
fabrication.
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Last Updated July 30, 1997 by
Steve Tell.